Nickel plating processes, while widely used, come with their own set of challenges, especially when it comes to upscaling from laboratory setups to larger plating cells. The NICKEFFECT project, aimed at developing Ni-alloy plated electrodes, faces not only the inherent limitations of nickel plating but also the complexities introduced by the porous structures. Addressing Throwing Power Limitations: One notable challenge in nickel plating processes is the limited throwing power compared to other methods, leading to edge effects with uneven deposit thickness near substrate borders. The NICKEFFECT project acknowledges this hurdle and seeks to overcome it during the upscaling process. Managing Current Density Variations: Ni-alloy plating introduces an additional layer of complexity, as the alloy content in the deposit strongly depends on current density. Factor in the three-dimensional structures, and you face varying current density and deposit thickness throughout the substrate. Achieving uniformity in thickness and alloy content becomes a formidable task, especially when upscaling...
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